AMD Ryzen 9 7945HX3D

AMD Ryzen 9 7945HX3D: World’s First Notebook CPU with 3D V-Cache Technology

Sunnyvale, CA – In a groundbreaking announcement, AMD has introduced the Ryzen 9 7945HX3D, the world’s first notebook CPU featuring the revolutionary 3D V-Cache technology. Building on the success of its predecessor, the Ryzen 9 7945HX, this latest offering boasts double the L3 cache, a remarkable increase from 64MB to an impressive 128MB, resulting in a total cache of 145MB.


The 3D V-Cache technology, initially introduced in the Ryzen 7 5800X3D desktop processor last year, effectively incorporates an additional layer of memory onto the CPU die. Although most applications demonstrate no significant improvements from the augmented cache, it’s in gaming where the true potential is unleashed. The augmented on-die memory alleviates the need for frequent access to slower and distant system memory, leading to faster frame processing and overall heightened frame rates.

Similar to the Ryzen 9 7945HX, the Ryzen 9 7945HX3D features 16 Zen4 cores and 32 threads, evenly distributed across two core complexes (CCDs). The cache distribution remains consistent across the two CCDs, with one CCD benefiting from an additional 64MB of L3 cache, resulting in a distribution of 96MB on one CCD and 32MB on the other. Gaming operations take place on the CCD with 8 cores, while the other CCD remains inactive unless specifically requested by the program. This behavior mirrors that of the desktop 7950X3D and 7900X3D parts.

The Ryzen 9 7945HX3D is no slouch when it comes to performance either, boasting a maximum boost frequency of 5.4GHz. Enthusiasts can further push the boundaries by overclocking the processor manually or allowing AMD Precision Boost Overdrive to handle it automatically. The default thermal design power (TDP) for this chip is 55W, but notebook manufacturers have the flexibility to configure it between 55W and 75W. In a move to address the thermal challenges posed by the extra memory layer, the maximum operating temperature has been reduced to 89°C, aligning with other 3D V-Cache models.

ASUS ROG Scar 17 will be the first notebook to sport the Ryzen 9 7945HX3D, with its release scheduled for August 22. The chip will gradually be made available in other notebook models worldwide.

AMD’s Ryzen 9 7945HX3D marks a significant leap in notebook CPU technology, promising improved gaming experiences and enhanced overall performance for users across the globe. With the advent of 3D V-Cache, AMD continues to push the boundaries of innovation in the computing industry.


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